WALTHAM, Mass. — Olympus has launched new software and solutions for the eddy current array and bond testing modules used with the field-proven OmniScan MX flaw detector.
To meet the requirements of a broader range of applications, conventional eddy current testing (ECT), eddy current array (ECA) and the new bond testing (BT) C-scan technology are available with the two module versions. Both of these modules are compatible with the redesigned MXE (ECT/ECA) and MXB (BT C-scan) software, providing easy transition between technologies and a short learning curve. Thanks to its intuitive interface design, the OmniScan MX ECA is quick and easy to configure and operate.
The OmniScan MX in ECA mode has a unique ability to perform inspections through thin coatings on conductive material. The new C-scan BT technology on the OmniScan MX ECA/ECT instrument is ideal for honeycomb composite inspections. This MX BT software is dedicated exclusively to the bond testing C-scan solution and features the same user-friendly interface as the MXE software to help minimize the learning curve.
For more information, visit www.olympus-ims.com or call (781) 419-3900.
